Power chips are connected to exterior circuits through product packaging, and their efficiency relies on the assistance of the packaging. In high-power circumstances, power chips are typically packaged as power components. Chip interconnection describes the electrical link on the upper surface of the chip, which is generally light weight aluminum bonding wire in traditional components. ^
Typical power component package cross-section
Today, industrial silicon carbide power modules still primarily make use of the product packaging innovation of this wire-bonded traditional silicon IGBT module. They encounter problems such as huge high-frequency parasitical specifications, insufficient heat dissipation capability, low-temperature resistance, and insufficient insulation stamina, which restrict making use of silicon carbide semiconductors. The screen of exceptional efficiency. In order to solve these problems and totally make use of the big possible advantages of silicon carbide chips, numerous new packaging technologies and options for silicon carbide power components have actually arised in recent times.
Silicon carbide power module bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have established from gold wire bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have developed from gold wires to copper cables, and the driving force is expense decrease; high-power devices have established from aluminum wires (strips) to Cu Clips, and the driving force is to boost item efficiency. The better the power, the higher the needs.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that uses a solid copper bridge soldered to solder to attach chips and pins. Compared to standard bonding packaging techniques, Cu Clip technology has the following advantages:
1. The connection in between the chip and the pins is made from copper sheets, which, to a certain extent, replaces the typical wire bonding technique between the chip and the pins. Therefore, a distinct package resistance value, greater current circulation, and far better thermal conductivity can be acquired.
2. The lead pin welding location does not need to be silver-plated, which can fully conserve the expense of silver plating and inadequate silver plating.
3. The item look is totally regular with regular products and is mostly used in servers, portable computer systems, batteries/drives, graphics cards, motors, power products, and other fields.
Cu Clip has two bonding approaches.
All copper sheet bonding approach
Both eviction pad and the Source pad are clip-based. This bonding method is extra pricey and complex, however it can attain much better Rdson and far better thermal effects.
( copper strip)
Copper sheet plus cord bonding method
The source pad uses a Clip approach, and the Gate utilizes a Cable technique. This bonding method is somewhat less expensive than the all-copper bonding technique, conserving wafer area (applicable to extremely little entrance areas). The process is less complex than the all-copper bonding method and can obtain better Rdson and far better thermal effect.
Distributor of Copper Strip
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